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Packaging

Shanghai, China

SWOP 2026

International Food Processing and Packaging Exhibition. Lightweight, personalization, new materials, new technologies, sustainability, new design trends and other popular topics, aiming cutting-edge concepts and technologies

Official WebsiteEmailMap

Show Brief

once a year

Audience

Trade Public

Duration

3 days

Dates

Nov. 16 - 18, 2026

Related program

3 concurrent fairs listed

Concurrent Fairs

Shows running alongside this event.

3/3 linked
ANALYTICA CHINA 2026Nov 16, 2026 - Nov 18, 2026Shanghai, ChinaCIAAR 2026Nov 16, 2026 - Nov 18, 2026Shanghai, ChinaFILTRATION & SEPARATION ASIA 2026Nov 18, 2026 - Nov 20, 2026Shanghai, China

Industries

PackagingPaper IndustryPlastics, Rubber, CompositesAdvanced MaterialsIndustrial ControllersLogistics & StorageResearch & Development

Venue

Venue
Shanghai New International Expo Centre - SNIEC
Address
2345 Longyang Road, Pudong New Area Shanghai P.R.C. 201204
City
Shanghai
Country
China
Website
www.sniec.net
Email
info@sniec.net
Phone
+86 (21) 2890 6666