IC PACKAGING FAIR 2026

Name: IC PACKAGING FAIR 2026
Start: 2026-10-27T00:00:00.000Z
End: 2026-10-29T00:00:00.000Z
Location: Shenzhen World Exhibition & Convention Center

IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...

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Show Brief

once a year

Audience

Trade Public

Duration

3 days

Dates

Oct. 27 - 29, 2026

Related program

7 concurrent fairs listed

Concurrent Fairs

Shows running alongside this event.

5/7 linked

6 CONNECTED SHOWS - A MEGA FEAST OF INNOVATION 2026Oct 27, 2026 - Oct 29, 2026Shenzhen, China FILM & TAPE EXPOOct 27, 2026 - Oct 29, 2026Shenzhen, China NEPCON AsiaOct 27, 2026 - Oct 29, 2026Shenzhen, China AUTOMOTIVE WORLD CHINA 2026Oct 27, 2026 - Oct 29, 2026Shenzhen, China ICE CHINA 2026Oct 27, 2026 - Oct 29, 2026Shenzhen, China

S-FACTORY EXPO SHENZHEN

No matching event record yet

C-TOUCH & DISPLAY SHENZHEN

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Industries

Electronic Design & ComponentsApplied Computer & Industrial Engineering

Venue

Venue: Shenzhen World Exhibition & Convention Center
Address: No.1 Zhancheng Road Fuhai Street Bao’an District Shenzhen, Guangdong
City: Shenzhen
Country: China
Website: www.shenzhen-world.com/en/index.html
Email: zhaomolei@cmhk.com
Phone: +86 0755-32937926

Organizer

Organizer: RX China
Address: 15th Floor, Tower A, Pingan International Finance Center No.1-3, Xinyuan South Road Chaoyang District Beijing 100027
Website: rxglobal.com/rx-china
Email: nancy.zhang@rxglobal.com
Phone: +86 10 5933 9000

Contact

Email: nancy.zhang@rxglobal.com
Phone: +86 10 5933 9000
Fax: +86 10 5933 9333
Official website: www.nepconasia.com/en-gb/bandaoti/ic-pack.html