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Electronic Design & Components

Tokyo, Japan

IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Official WebsiteEmailMap

Show Brief

once a year

Audience

Trade Public

Duration

3 days

Dates

Feb. 17 - 19, 2027

Related program

13 concurrent fairs listed

Concurrent Fairs

Shows running alongside this event.

10/13 linked
AUTOMOTIVE WEIGHT REDUCTION EXPO JAPAN - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, JapanFINE PROCESS TECHNOLOGY EXPO JAPAN - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, JapanPWB EXPO - PRINTED WIRING BOARDS EXPO JAPAN - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, JapanCAR-ELE JAPAN - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, JapanGREEN FACTORY EXPO JAPAN - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, JapanROBODEX JAPAN 2027Feb 17, 2027 - Feb 19, 2027Tokyo, Japan

COSME WEEK - TOKYO

No matching event record yet

INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW 2027Feb 17, 2027 - Feb 19, 2027Tokyo, Japan

SMART FACTORY EXPO (SFE) JAPAN

No matching event record yet

ELECTROTEST JAPAN - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, Japan

NEPCON JAPAN - TOKYO

No matching event record yet

WEARABLE EXPO - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, JapanEV JAPAN - TOKYO 2027Feb 17, 2027 - Feb 19, 2027Tokyo, Japan

Industries

Electronic Design & ComponentsTesting & Measurement

Venue

Venue
Tokyo International Exhibition Center (Tokyo Big Sight)
Address
3-21-1 Ariake Koto-ku Tokyo 135-0063
City
Tokyo
Country
Japan
Website
www.bigsight.jp/english
Phone
+81 (0)3 5530 1111

Organizer

Organizer
RX Japan
Address
18F Shinjuku - Nomura Building 1-26-2 Nishishinjuku Shinjuku - ku Tokyo 163-0570
Website
www.rxjapan.jp/en
Email
info@reedexpo.co.jp
Phone
+81 (0)3 3349-8501