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Electronic Design & Components

Nagoya, Japan

IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA 2026

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

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Show Brief

once a year

Audience

Trade Public

Duration

3 days

Dates

Nov. 25 - 27, 2026

Related program

12 concurrent fairs listed

Concurrent Fairs

Shows running alongside this event.

8/12 linked
AUTOMOTIVE WEIGHT REDUCTION EXPO JAPAN - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, JapanEV JAPAN - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, Japan

NEPCON JAPAN - NAGOYA

No matching event record yet

AUTOMOTIVE WORLD - NAGOYA

No matching event record yet

FINE PROCESS TECHNOLOGY EXPO JAPAN - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, JapanPWB EXPO - PRINTED WIRING BOARDS EXPO - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, JapanCAR-ELE JAPAN - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, Japan

GREEN FACTORY EXPO JAPAN - NAGOYA

No matching event record yet

PWB EXPO - PRINTED WIRING BOARDS EXPO JAPAN - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, JapanELECTROTEST JAPAN - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, JapanINTERNEPCON JAPAN - NAGOYA 2026Nov 25, 2026 - Nov 27, 2026Nagoya, Japan

SMART LOGISTICS EXPO - NAGOYA

No matching event record yet

Industries

Electronic Design & ComponentsTesting & Measurement

Organizer

Organizer
RX Japan
Address
18F Shinjuku - Nomura Building 1-26-2 Nishishinjuku Shinjuku - ku Tokyo 163-0570
Website
www.rxjapan.jp/en
Email
info@reedexpo.co.jp
Phone
+81 (0)3 3349-8501